- patented trench schottky technology - excellent high temperature stability - low forward voltage - low power loss/ high efficiency - high forward surge capability packing code with suffix "g" means green compund (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 2 whisker test symbol unit v rrm v dv/dt v/ s v ac v i f = 5a i f = 7.5a i f = 15a i f = 5a i f = 7.5a i f = 15a t j = 25c a t j = 125c ma r jc o c/w t j o c t stg o c version: c14 - halogen-free according to iec 61249-2-21 definition typical applications trench schottky barrier rectifie r are designed for high frequency miniature switched mode power supplies such as adapters, lighting and on-board dc/dc converters. mechanical data case: ito-220ab TSF30H60C maximum repetitive peak reverse voltage maximum average forward rectified current taiwan semiconductor trench schottk y rectifier features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec 60 voltage rate of change (rated v r ) 10000 molding compound meets ul 94 v-0 flammability rating polarity: as marked mounting torque: 0.56 nm max. weight: 1.7 g (approximately) maximum ratings and electrical characteristics (t a =25 o c unless otherwise noted) a parameter a per diode 15 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load per diode i fsm 170 per device i f(av) 30 t j = 125c 4.5 - v f v isolation voltage from terminal to heatsink t = 1 min 1500 min. typ. - - - note 1: pulse test with pulse width=300 s, 1% duty cycle instantaneous reverse current per diode at rated reverse voltage i r typical thermal resistance per diode t j = 25c operating junction temperature range - 55 to +150 storage temperature range - 55 to +150 0.45 0.48 0.55 instantaneous forward voltage per diode ( note1 ) - TSF30H60C - ito-220ab max. 0.36 - - - - 10 500 45 0.70 - - - 0.41 0.52 15
part no. TSF30H60C (t a =25 o c unless otherwise noted) version: c14 packing TSF30H60C c0g TSF30H60C preferred part no. TSF30H60C taiwan semiconductor ordering information green compound description 50 / tube ratings and characteristics curves packing code packing code suffix package part no. packing code example c0 g c0 g ito-220ab packing code suffix 0 10 20 30 40 0 255075100125150 average forward current (a) case temperature ( o c) fig.1 forward current derating curve with heatsink 3in ? x ? 5in ? x ? 0.25in al \ plate 0.001 0.01 0.1 1 10 100 10 20 30 40 50 60 70 80 90 100 instantaneous reverse current (ma) percent of rated peak reverse voltage (%) fig. 3 typical reverse characteristics per leg t j =25 o c t j =100 o c t j =125 o c t j =150 o c 0.1 1.0 10.0 100.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 instantaneous forward current (a) forward voltage (v) fig. 2 typical forward characteristics per leg pulse width=300 s 1% duty cycle t j =25 o c t j =100 o c t j =125 o c t j =150 o c 100 1000 10000 0.1 1 10 100 junction capacitance (pf) a reverse voltage (v) fig. 4 typical junction capacitance per leg f=1.0mhz vsig=50mvp-p
package outline dimensions min max min max a 4.30 4.70 0.169 0.185 b 2.50 3.16 0.098 0.124 c 2.30 2.96 0.091 0.117 d 0.46 0.76 0.018 0.030 e 6.30 6.90 0.248 0.272 f 9.60 10.30 0.378 0.406 g 3.00 3.40 0.118 0.134 h 0.95 1.45 0.037 0.057 i 0.50 0.90 0.020 0.035 j 2.40 3.20 0.094 0.126 k 14.80 15.50 0.583 0.610 l - 4.10 - 0.161 m 12.60 13.80 0.496 0.543 n - 1.80 - 0.071 o 2.41 2.67 0.095 0.105 p/n = specific device code g = green compound yww = date code f = factory code version: c14 TSF30H60C taiwan semiconductor dim. unit (mm) unit (inch) marking diagram ito-220ab
creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. version: c14 TSF30H60C taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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